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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2058-04-26 |
| Par Value | 1000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 222000.00 |
| Coupon | 4.75 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 222000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This SoftBank Group Corp. corporate bond has a 4.75% fixed-floating rate rate coupon paid on a semi-annual basis. It was issued on April 28, 2023 with an issue size of 222000.00 million JPY and matures on April 26, 2058 with a last coupon date of October 28, 2057. |
SoftBank Group Corp. was founded in 1981 and is headquartered in Tokyo, Japan. The company primarily focuses on technology investments, telecommunications, and internet services, positioning itself as a leader in the global technology landscape. With a diverse portfolio that includes stakes in companies such as Alibaba and Uber, SoftBank aims to support and accelerate innovation across various sectors.