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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2026-12-18 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 25000.00 |
| Coupon | 0.55 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 25000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Acom Co Ltd corporate bond has a 0.55% fixed rate coupon paid on a semi-annual basis. It was issued on December 19, 2023 with an issue size of 25000.00 million JPY and matures on December 18, 2026 with a last coupon date of June 19, 2026. |
Acom Co Ltd, founded in 1980 and headquartered in Tokyo, Japan, operates to provide convenient consumer credit solutions. The company specializes in personal loans, credit card services, and point-of-sale financing, catering primarily to individuals looking for flexible borrowing options.