JP2010001M23 · HOKKA 0.15% 2031-02-26 JPY — Hokkaido (Munici | SQX Bonds

Hokkaido (Municipal) bond | 0.14% 2031-02-26 JPY | JP2010001M23

Change % : ▼-0.189%

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Overview

pricing as of 2026-09-11

2.37

Coupon

0.145

90.657

Maturity

2031-02-26

Currency

JPY

High/Low (52 week)

93.904/90.443

Analytics

Mod. Duration

4.383

Mac. Duration

4.435

Convexity

19.721

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Bond Information

Issue Type	Login
Country	Japan
Industry	Login
Region	Login
Maturity Date	2031-02-26
Par Value	10000
Callable	Login
Next Call Date	Login
Call Type	Login
Call Price (%)	Login
Series	Login
Class	Login
Maturity Structure	Login
Amount Outstanding (mil)	20000.00

Coupon Information

Coupon	0.145
Coupon Type	Login
Coupon Frequency	Login
First Coupon Date	Login
Last Coupon Date	Login

Risk Information

Sinking Fund	Login
Security	Login
Subordination	Login
Debt Type	Login

Issuance Information

Issue Date	Login
Dated Date	Login
Issue Size (mil)	20000
Min. Piece	Login
Min. Increment	Login

About the HOKKA 0.15% 2031-02-26 JPY bond (JP2010001M23)

This Hokkaido (Municipal) municipal bond has a 0.14% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 20000.00 million JPY and matures on February 26, 2031 with a last coupon date of FEB 28, 2020.