JP2010001J69 · HOKKA 0.21% 2028-06-29 JPY — Hokkaido (Munici | SQX Bonds

Hokkaido (Municipal) bond | 0.20% 2028-06-29 JPY | JP2010001J69

Change % : ▲ +0.039%

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Overview

pricing as of 2026-09-04

1.90

Coupon

0.205

97.002

Maturity

2028-06-29

Currency

JPY

High/Low (52 week)

97.77/96.956

Analytics

Mod. Duration

1.786

Mac. Duration

1.803

Convexity

3.256

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Bond Information

Issue Type	Login
Country	Japan
Industry	Login
Region	Login
Maturity Date	2028-06-29
Par Value	10000
Callable	Login
Next Call Date	Login
Call Type	Login
Call Price (%)	Login
Series	Login
Class	Login
Maturity Structure	Login
Amount Outstanding (mil)	20000.00

Coupon Information

Coupon	0.205
Coupon Type	Login
Coupon Frequency	Login
First Coupon Date	Login
Last Coupon Date	Login

Risk Information

Sinking Fund	Login
Security	Login
Subordination	Login
Debt Type	Login

Issuance Information

Issue Date	Login
Dated Date	Login
Issue Size (mil)	20000
Min. Piece	Login
Min. Increment	Login

About the HOKKA 0.21% 2028-06-29 JPY bond (JP2010001J69)

This Hokkaido (Municipal) municipal bond has a 0.20% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 20000.00 million JPY and matures on June 29, 2028 with a last coupon date of FEB 28, 2020.