SQXlogo
  • My Dashboard
  • Bond Academy
  • Tools
    • Bond Screener
    • Issuer Directory
    • Portfolio Builder
    • Discussion Board
  • Data Partners
‌
‌
  • Home
  • My Dashboard
  • Bond Academy
  • Tools
  • Data Partners
  • LoginCreate a free account
SQX-logo
SQX-white-logo© SQX BONDS. All rights reserved | Privacy Policy | Terms and Conditions | Represent a financial institution? | Customer Support
Visit SQXBonds on linkedinVisit SQXBonds on LinkedInVisit SQXBonds on facebookVisit SQXBonds on LinkedInVisit SQXBonds on instagramVisit SQXBonds on LinkedInVisit SQXBonds on twitterVisit SQXBonds on LinkedInVisit SQXBonds on iplVisit SQXBonds on LinkedIn
←Back

CLP Power Hongkong Financing bond | 3.78% 2029-08-06 HKD | HK0000209533

Change % : ▼-0.014%

View all data FOR FREE!

Create an account today, no credit card required.

Overview

pricing as of 2026-10-14
4.63
3.780
97.796
2029-08-06
HKD
102.669/97.466

Analytics

2.583
2.702
7.475
‌
‌
‌
‌

Bond Information

Issue Type
Login
Country
British Virgin Islands
Industry
Login
Region
Login
Maturity Date
2029-08-06
Par Value
Callable
Login
Next Call Date
Login
Call Type
Login
Call Price (%)
Login
Series
Login
Class
Login
Maturity Structure
Login
Amount Outstanding (mil)
300.00

Coupon Information

Coupon
3.78
Coupon Type
Login
Coupon Frequency
Login
First Coupon Date
Login
Last Coupon Date
Login

Risk Information

Sinking Fund
Login
Security
Login
Subordination
Login
Debt Type
Login

Issuance Information

Issue Date
Login
Dated Date
Login
Issue Size (mil)
300.00000
Min. Piece
Login
Min. Increment
Login

About the CHINLP 3.78% 2029-08-06 HKD bond (HK0000209533)

This CLP Power Hongkong Financing Ltd. corporate medium term notes has a 3.78% fixed rate coupon paid on a Login basis. It was issued on MAR 12, 2000 with an issue size of 300.00 million HKD and matures on August 06, 2029 with a last coupon date of FEB 28, 2020.

More bonds from CLP Power Hongkong Financing Ltd.

CHINLP 3.45% 2033-03-22 HKD

HK0000410263

Pays a 3.45% coupon and matures on March 22, 2033.

92.51 HKD▲ 0.01

CHINLP 3.16% 2032-03-09 HKD

HK0000333390

Pays a 3.16% coupon and matures on March 09, 2032.

91.65 HKD▼ -0.01

CHINLP 2.47% 2031-08-25 HKD

HK0000305646

Pays a 2.465% coupon and matures on August 25, 2031.

90.59 HKD▼ -0.01

CHINLP 3.22% 2030-03-20 HKD

HK0000241080

Pays a 3.22% coupon and matures on March 20, 2030.

95.49 HKD▼ -0.01

CHINLP 4.46% 2027-04-23 HKD

HK0001007928

Pays a 4.46% coupon and matures on April 23, 2027.

100.36 HKD▼ -0.02

CHINLP 3.38% 2027-10-26 USD

XS0848445358

Pays a 3.375% coupon and matures on October 26, 2027.

98.24 USD▼ -0.05

About the issuer CLP Power Hongkong Financing Ltd.

CLP Power Hongkong Financing Ltd., founded in Hong Kong, serves as the financing arm of CLP Group, a leading energy provider in the region. The company's primary purpose is to raise funds to support the financing activities of its parent company, focusing on energy and infrastructure projects within Hong Kong and the Asia-Pacific region.